Contractor ASIC Package Engineer

Role: ASIC Package Engineer SI/PI Engineer

Location: Remote

Interview: Phone/Skype

Job Type: Contract

Responsibilities:

• Drive chip-package-system co-design by driving signal and power integrity requirements analysis and optimization.
• Define power tree structure and netlists for High Performance Computing based on 2.5D/3D package technology.
• Run pre-layout and post-layout simulation flow for high-speed interface and PDN.
• Develop SIPI validation methodology and detailed engineering test plans.
• Validate high-speed interface and PDN impedance in lab.
• Collaborate with Architecture, ASIC, Mixed Signal, Package, and PCB Design teams.
• Perform package/board power delivery network AC+DC simulation.
• Develop next-gen memory interface considering IO PHY, SI/PI, and physical design.

Skills:

• SIPI
• ASIC Packaging
• High-Speed Interface
• Power Tree
• Simulation
• Validation
• Electromagnetics
• MIPI
• PCIe
• Cadence Sigrity
• PowerSI
• Ansys SIwave
• Keysight ADS
• 3D Layout
• Ansys HFSS

Eligibility Criteria:

• Genuine H1B candidates with verifiable I-94 travel history (C2C acceptable).
• Green Card & US Citizens will be considered only on W2 payment terms.

What is the last date for applying to the job?

Which countries are accepted for this remote job?