Full-Time RF Engineer
Smiths Group is hiring a remote Full-Time RF Engineer. The career level for this job opening is Experienced and is accepting Suzhou, China based applicants remotely. Read complete job description before applying.
Smiths Group
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Support, contribute and promote a safe work environment.
Perform signal integrity simulations for engineering designs on connectors or semiconductor IC chip test sockets or probe heads.
Develops technology and processes for high-speed measurement of test sockets, connectors, PCB’s and other components.
Designs and develops PCBs and fixtures for testing and characterization of engineering designs.
Set up machines, equipment and design/develop process fixtures.
Responsible for prototyping and evaluation of new products in leading edge applications.
Interprets customer specifications and writes test procedures to qualify new and existing products.
Recommends capital investments for leading edge technologies that will keep the company on the forefront of the industry. Specify tooling and equipment needed to support the production build.
Provide technical support to organizational stakeholders (Production, Quality, Marketing and Sales).
Consult with Sales in quoting customer requirements and bid preparation.
Participate and contribute to team training, development, mentoring and audits.
Demonstrate behaviors consistent with company policies.
Coordinates with project team to ensure milestones are achieved and risks are mitigated.
Provides test plans, schedules and cost work sheets for qualification of new and existing products
Suggests changes in working conditions and use of equipment, systems, tools and process to increase organizational efficiency.
Analyzes and resolves work problems and/or assists others in solving work problems.
Relies on extensive experience, analytical capacity, problem solving skills/tools and judgment to plan and accomplish goals.
General educational, experience and competency requirements defined in current revision of the “Engineering Career Ladder”.
Knowledge of RF, Digital and Power cables and connectors or related knowledge.
Familiar using HFSS to perform simulation to generate IL, RL, TDR, and Crosstalk.
Understanding of RF/Signal Integrity simulations on electric-mechanical structures.
Understanding of RF/Digital test equipment, software and procedures.
Be able to use VNA to perform electrical measurement.
Ability to perform Root Cause Analysis utilizing standard problem-solving tools and methodologies.
Knowledge of 3D modeling using drawing and simulation packages.
Knowledge of PCB design (Plus only)